Adhesion of functional layer on polymeric substrates for optoelectronic applications

E. Amendola; A. Cammarano; M. Pezzuto; D. Acierno

doi:10.2971/jeos.2009.09027

Journal of the European Optical Society - Rapid publications, Vol 4 (2009)

Adhesion of functional layer on polymeric substrates for optoelectronic applications

E. Amendola, A. Cammarano, M. Pezzuto, D. Acierno

Abstract

The use of plastic film substrates for organic electronic devices promises to enable new applications, such as flexible displays. Plastic substrates have several distinct advantages, such as ruggedness, robustness, ultra lightness, conformability and impact resistance over glass substrates, which are primarily used in flat panel displays (FPDs) today. However, high transparency, proper surface roughness, low gas permeability and high transparent electrode conductivity of the plastic substrate are required for commercial applications. Polyesters, both amorphous and semicrystalline, are a promising class of commercial polymer for optoelectronic applications. Surface modification of polyester films was performed via chemical solution determining hydrolysis or oxidation. Hydrolysis was carried out by means of sodium hydroxide solution and oxidation by using standard clean 1 (SC-1) of RCA procedure [1]. For this work we have used commercial polymer films of 100µm in thickness: AryLite™ [2], supplied by Ferrania Imaging Technologies S.p.A. and characterised by very high glass transition temperature, Mylar™ (Polyethylene Terephthalate PET) and Teonex™ (Polyethylene Naphthalate PEN) both supplied by Dupont. More over, a bioriented and semicrystalline PET have been used.
The aim of this study is modifying the polymer surface to improve the adhesion between organic-inorganic layer. It was found that the NaOH and SC-1 treatment cause a decrease of contact angles. In the present study we have deposited a thin films of amorphous hydrogenated silicon (a-Si:H) and its oxide (SiO2) on a new high temperature polymer substrate, AryLite™, by plasma enhanced chemical vapour deposition (PECVD) [3], with a radio frequency plasma system.

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